Alumni Visiting Committee
The Visiting Committee consists of Departmental alumni who meet with faculty, staff and students once a year and provide advice on strategic initiatives and future directions for growth.
We are grateful to the members of this committee for their contributions:
|Bruce H. Dean received the B.A., M.S., and Ph.D. degrees in Physics from WVU (1991, 1994, 1999), as well as the M.S. Degree in Mathematics in 1996. After graduating, Bruce joined the NASA Goddard Space Flight Center where he began work as an Optical Physicist, and later formed a Wavefront Sensing and Control Group where he is currently Group Leader. Bruce holds 10 U.S. Patents and is the lead wavefront sensing algorithm developer for the James Webb Space Telescope. He has received numerous awards including: the NASA Headquarters Exceptional Technology Achievement Medal, the Federal Executive Board Bronze Award for Volunteer Service, and the Goddard Honor Award for Engineering Achievement.|
|William F. (Bill) Lawson is the Director of Technology Commercialization at the University of Tulsa since August, 2007, reporting to the Vice-Provost of Research. Dr. Lawson is an applied physicist with a broad technology background including 31 years at DOE’s National Energy Technology Laboratory and its precursors, the last 12 years of which he served in leadership roles in the oil and gas research program area. He retired from DOE in January, 2006, as the first Director of DOE’s Strategic Center for Natural Gas and Oil. Dr. Lawson served as the Executive Director of the Petroleum Technology Transfer Council from 2011 through 2012. He taught as an adjunct professor for the 2006-2007 academic year at the University of Oklahoma in the colleges of Business and Earth and Energy. Dr. Lawson received all his collegiate degrees in physics from West Virginia University. He retired from the United States Navy with the rank of Commander.|
|John Lannon received B.S., and Ph. D. degrees in Physics from WVU (1991, 1996). and is currently is the General Manager of Micross Advanced Interconnect Technology. Since 2002, he has worked on the fabrication and improvement of resistive IR emitter devices (a MEMS-like device) for Infrared Scene Projectors. Beginning in 2005, he assisted with the development of high density interconnects (sub-20 µm pitch) for die stacking and detector hybridization and more recently contributed to the development of wafer-level vacuum packaging (WLVP) for MEMS devices. As part of Micross, he continues to be focused on the development and implementation of 3D integration and advanced packaging technologies (flip-chip bumping, high density interconnect bonding, WLVP, through-Si vias (TSV), through glass via (TGV), Si interposers, etc.) for government and commercial applications, as well as the development of novel 3D microstructures. John is an active member of AVS, currently serving as Past Chair of the Mid-Atlantic AVS Chapter and as a member of the AVS short course executive committee and Educational Materials & Outreach committee.|